Projects per year
Projects
- 13 Finished
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Finished
適用於5G NR系統之雙頻帶氮化鎵射頻收發機晶片技術開發
Hsu, H.-T. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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運用氮化鋁中介板實現毫米波段波束切換天線模組之系統封裝開發(1/2)
Hsu, H.-T. (PI)
1/01/22 → 31/12/22
Project: Government Ministry › Other Government Ministry Institute
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適用於未來6G應用之高效能元件開發與電路技術研究
Hsu, H.-T. (PI)
1/08/21 → 31/07/22
Project: Government Ministry › Other Government Ministry Institute
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Research and development of intrinsically linear GaN HEMTs at millimeter-wave frequencies
Hsu, H.-T. (PI)
1/08/20 → 31/07/21
Project: Government Ministry › Other Government Ministry Institute
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Development of key components using GaN technology for applications in RF front-ends of 5th generation communication systems
Hsu, H.-T. (PI)
1/08/19 → 31/07/20
Project: Government Ministry › Other Government Ministry Institute
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氮化鎵鋁/氮化鎵元件之Ka頻段單晶微波積體電路功率放大器實現(2/2)
Hsu, H.-T. (PI)
1/01/19 → 31/12/19
Project: Government Ministry › Other Government Ministry Institute
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Development of InAlN/GaN HEMT with Ft>200GHz
Hsu, H.-T. (PI)
1/08/18 → 31/07/19
Project: Government Ministry › Other Government Ministry Institute
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Development of key components using GaN technology for applications in RF front-ends of 5th generation communication systems
Hsu, H.-T. (PI)
1/08/18 → 31/07/19
Project: Government Ministry › Other Government Ministry Institute
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氮化鎵鋁/氮化鎵元件之Ka頻段單晶微波積體電路功率放大器實現(1/2)
Hsu, H.-T. (PI)
1/01/18 → 31/12/18
Project: Government Ministry › Other Government Ministry Institute
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Development of InAlN/GaN HEMT with Ft>200GHz
Hsu, H.-T. (PI)
1/08/17 → 31/07/18
Project: Government Ministry › Other Government Ministry Institute
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Optimization of Device Structure with Circuit Verification for GaN High Power Devices at Millimeter-wave Frequencies
Hsu, H.-T. (PI)
1/08/17 → 31/10/18
Project: Government Ministry › Other Government Ministry Institute
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Device Technology Development of GaN HEMT for High Power
Hsu, H.-T. (PI)
1/08/16 → 31/07/17
Project: Government Ministry › Other Government Ministry Institute
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Feasibility study of applying flip-chip packaging to connect
Hsu, H.-T. (PI)
1/08/15 → 31/07/16
Project: Government Ministry › Other Government Ministry Institute