Projects per year
Personal profile
Research Interests
nanomaterial for biosensors, functional nanomaterials, nanodevices, hybrid nanomaterial with innovative property and application, and flexible transistor and memory devices
Experience
1991/9 ~ 1996/6 Ph. D., Atomic Science, National Tsing Hua University
1996/10 ~ 2001/12 Associate Researcher, Research and Development, National Nano Device Labs
2002/1 ~ 2005/1 Researcher, Research and Development, National Nano Device Labs
2000/10 ~ 2002/12, 2004/2 ~ 2005/1 Department Manager, Department of Lithography and Etching, National Nano Device Labs
2005/2 ~ 2007/7 Associate Professor, Institute of Nanotechnology, National Chiao Tung University
2007/8 ~ present Professor, Department of Materials Science and Engineering, National Chiao Tung University
2013/7 ~ 2014/1 Visiting Professor, CALIT2, University of California, Irvine, CA
2014/2 ~ 2017/1 Associate Dean of Student Affairs, Office of Student Affairs, National Chiao Tung University
2017/2 ~ present Chair, Undergraduate Honors Program of Nano Science and Engineering, National Chiao Tung University
Education/Academic qualification
PhD, Atomic Science, National Tsing Hua University
External positions
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 30 Finished
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發展高可撓特性及透光性之薄膜電晶體感測器並應用於檢測金屬離子(3/3)
Ko, F.-H. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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110學年度「大專校院推動創新創業教育計畫-大專校院創業實戰模擬學習平臺」
Ko, F.-H. (PI)
1/05/22 → 30/06/22
Project: Government Ministry › Ministry of Education(Include School)
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111年度U-start創新創業計畫
Ko, F.-H. (PI)
1/05/22 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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重點產業高階人才培訓計畫
Ko, F.-H. (PI)
1/02/22 → 31/03/23
Project: Government Ministry › Other Government Ministry Institute
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111年度國立陽明交通大學中小企業創育機構發展計畫(交大校區)(政府補助款)
Ko, F.-H. (PI)
1/01/22 → 31/12/22
Project: Government Ministry › Ministry of Economic Affairs
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Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force
Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Aluminum-doped zinc oxide thickness controllable wavelengths in visible light and high responsivity devices using interrupted flow atomic layer deposition
Tseng, P. H., Lai, Y. S., Huang, C. M., Tsai, S. Y. & Ko, F. H., May 2024, In: Journal of Materials Science: Materials in Electronics. 35, 13, 922.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding
Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 75-76 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Daytime radiative cooling of single-board computer in nearly enclosed unmanned surface vehicle
Chen, Y. J., Chang, S. W., Wang, H. C., Lim, S. K., Huang, C. I., Ko, F. H., Lo, Y. C., Wan, D. & Chen, H. L., May 2024, In: Solar Energy Materials and Solar Cells. 268, 112723.Research output: Contribution to journal › Article › peer-review
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Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2184-2188 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review