Network
G. E. Stillman
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- Univ. Illinois at Urbana-Champaign
- CCEEL
- Department of Materials Science and Engineering
- Depament of Electrical and Computer Engineering
- Dept. of Mat. Sci. and Engineering
External person
C. H. Diaz
- Advanced Device Technology Department
- Taiwan Semiconductor Manufacturing Company
- IEEE
- Device Technology and Modeling Department
- Research and Development
- SBIP
External person
Y. C. Lin
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Department of Materials Science and Engineering
- Institute of Materials Science and Engineering
- Department of Material Science and Engineering
- Nippon Telegraph & Telephone
- Department of Electrical Engineering
- Microelectronics and Information Systems Research Center
- Taiwan Semiconductor Manufacturing Company
- Integrated Interconnect and Packaging Division
- Dept. of Matl. Sci. & Eng.
External person
T. B. Wu
- National Tsing Hua University
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering
- Department O Electronics Engineering
- National Yang Ming Chiao Tung University
- Department of Materials Science and Engineering
- University of Illinois at Urbana-Champaign
- Department of Materials Science and Engineering
External person
Yi Shuo Huang
- National Yang Ming Chiao Tung University
- International College of Semiconductor Technology
External person
C. H. Ma
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering
External person
J. M. Kuo
- Lucent
- Rutgers - The State University of New Jersey, New Brunswick
- Lucent Technologies
- Multiplex Inc.
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Rutgers University
External person
A. P. Curtis
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- Dept. of Mat. Sci. and Engineering
- CCEEL
External person
P. A. Friddle
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Department of Materials Science and Engineering
- Dept. of Physics and Materials Sci.
- City University of Hong Kong
External person
S. Thomas
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- CCEEL
External person
B. M. Yen
- University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Materials Science and Engineering
- Texas Instruments
External person
Chang Fu Dee
- Institute of Micronengineering and Nanoelectronics (IMEN)
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Universiti Kebangsaan Malaysia
- Institute of Microengineering and Nanoelectronics
- Institute of Microengineering and Nanoelectronics (IMEN)
- Institute of Microengineering and Nanoelectronics
- Institute of Microengineering and Nanoelectronics
- Univ Kebangsaan Malaysia, Universiti Kebangsaan Malaysia, Inst Microengn & Nanoelect
External person
W. Wolbach
- Department of Materials Science and Engineering
- Northwestern University
- The University of Chicago
External person
B. C. Moser
- CCEEL
- University of Illinois at Urbana-Champaign
- Department of Materials Science and Engineering
- RFMD Inc.
External person
Chang Hsien Lin
- National Applied Research Laboratories Taiwan
- National Nano Device Laboratories Taiwan
- National Nano Device Laboratories (NDL
- Taiwan Semiconductor Manufacturing Company
- Stanford University
External person
Y. Lu
- Rutgers - The State University of New Jersey, New Brunswick
- Electrical and Computer Engineering Department
- United States Army Research Laboratory
- Beijing Univ Technol, Beijing University of Technology, Inst Microstruct & Property Adv Mat
- Rutgers University
External person
An Jye Tzou
- National Nano Device Laboratories Taiwan
- Department of Photonics and Institute of Electro-Optical Engineering
- National Yang Ming Chiao Tung University
- Department of Electrophysics
- Department of Photonics
- Inst. of Electro-Optical Engineering
- Department of Photonics
- National Applied Research Laboratories Taiwan
- Taiwan Semiconductor Research Institute
External person
Yu Ming Lin
- National Yang Ming Chiao Tung University
- Taiwan Semiconductor Manufacturing Company
External person
Lung Hsing Hsu
- Industrial Technology Research Institute Hsinchu
- National Yang Ming Chiao Tung University
- Academia Sinica - Research Center for Applied Science
- Acad Sinica, Academia Sinica - Taiwan, Res Ctr Appl Sci
External person
M. Dutta
- Electronics and Power Sources Directorate
- United States Army Research Laboratory
- Rutgers - The State University of New Jersey, New Brunswick
- U.S. Army ETDL
- Rutgers University
External person
Jia Hong Huang
- Department of Engineering and System Science
- National Tsing Hua University
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- National Taiwan University of Science and Technology
- Department of Materials Science and Engineering
- Department of Engineering
External person
Y. C. Yeo
- National University of Singapore
- Silicon Nano Device Laboratory
- University of California at Berkeley
- Department of Electrical Engineering and Computer Science
- Taiwan Semiconductor Manufacturing Company
- Department of EECS
- Department of Electrical Engineering and Computer Sciences
- Agency for Science, Technology and Research, Singapore
- Department of Electrical Engineering and Computer Sciences
- Department of Electrical Engineering and Computer Sciences
- Silicon Nano Device Lab.
- Department of Materials Science and Engineering
- Silicon Nano Device Lab (SNDL)
- Department of Electrical Engineering and Computer Science
- IEEE
- Technology
- Department of Electrical Engineering and Computer Sciences
- Silicon Nano Devices Laboratory
- Department of Electrical Engineering
- Silicon Nana Device Lab (SNDL)
- Department of Electrical Engineering and Computer Sciences
- Department of Electrical Engineering
External person
Chun Lin Chu
- National Nano Device Laboratories Taiwan
- Department of Electrical Engineering
- National Taiwan University
- Natl Appl Res Labs, National Applied Research Laboratories - Taiwan, Natl Nano Device Labs
- Taiwan Semiconductor Manufacture Co.
- National Applied Research Laboratories Taiwan
- NARL
External person
C. T. Lee
- Institute of Optical Sciences
- National Central University
- Institute of Microelectronics
- National Cheng Kung University
- Yuan Ze University
- Department of Photonics Engineering
- Department of Electrical Engineering
- Institute of Microelectronics
- Institute of Microelectronics
- Department of Material Science and Engineering
- National Yang Ming Chiao Tung University
- Institute of Microelectronics
- Department of Electrical Engineering
- Institute of Optical Sciences
- Institute of Optical Sciences
External person
R. Levi-Setti
- Department of Materials Science and Engineering
- Northwestern University
- The University of Chicago
External person
T. Horton
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- Dept. of Mat. Sci. and Engineering
External person
J. A. Eades
- Department of Materials Science and Engineering
- Northwestern University
- Department of Metallurgy and Mining Engineering
- University of Illinois at Urbana-Champaign
External person
Po Tsung Tu
- Industrial Technology Research Institute Hsinchu
- National Yang Ming Chiao Tung University
External person
H. Shen
- United States Army Research Laboratory
- Electronics and Power Sources Directorate
- Rutgers - The State University of New Jersey, New Brunswick
- U.S. Army ETDL
- Rutgers University
External person
W. F. Wu
- National Nano Device Laboratories Taiwan
- National Yang Ming Chiao Tung University
- Hsinchu
- Taiwan Semicond Res Inst
- Taiwan Semiconductor Manufacture Co.
- National Applied Research Laboratories Taiwan
- NARL
- National Tsing Hua University
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute (TSRI)
- Taiwan Semiconductor Research Institute
External person
Q. Yang
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Univ. Illinois at Urbana-Champaign
External person
Quang Ho Luc
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- International College of Semiconductor Technology
External person
G. L. Luo
- National Nano Device Laboratories Taiwan
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Microelectronics and Information Systems Research Center
- National Applied Research Laboratories Taiwan
- Department O Electronics Engineering
- Hsinchu
- Information Systems Research Center
- Nano Device Laboratory
- Hsinchu Science Park
- Hsinchu Science Park
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Manufacture Co.
- NARL
- Taiwan Semiconductor Research Institute
- National Cheng Kung University
External person
Hai Dang Trinh
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Department of Materials Science and Engineering
- Department of Physics
- Hanoi National University of Education
- Taiwan Semiconductor Manufacturing Company
- Department of Material Science and Engineering
External person
B. Y. Chen
- National Nano Device Laboratories Taiwan
- Hsinchu
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Manufacture Co.
- National Applied Research Laboratories Taiwan
- National Yang Ming Chiao Tung University
- NARL
- Taiwan Semiconductor Research Institute
External person
M. Feng
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- Univ. Illinois at Urbana-Champaign
- CCEEL
- Department of Materials Science and Engineering
- Dept. of Mat. Sci. and Engineering
External person
J. M. Chabala
- Department of Materials Science and Engineering
- Northwestern University
- The University of Chicago
External person
Jagadeesh Pamulapati
- Center for High-Frequency Microelectronics
- University of Michigan, Ann Arbor
- Electronics and Power Sources Directorate
- United States Army Research Laboratory
- Rutgers - The State University of New Jersey, New Brunswick
- U.S. Army ETDL
- Rutgers University
External person
H. C.H. Wang
- Taiwan Semiconductor Manufacturing Company
- National Taichung University of Science and Technology
External person
Shin Yuan Wang
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Department of Electrical Engineering
- Dept. of Electronics Engineering
- Department of Electronics Engineering and Institute of Electronics
- Institute of Electronics
- Natl Chiao Tung Univ, National Chiao Tung University, Coll Elect & Comp Engn, Inst Electroopt Engn
- National Applied Research Laboratories Taiwan
External person
Young Kim
- Department of Metallurgy and Mining Engineering
- University of Illinois at Urbana-Champaign
External person
Chi Chung Kei
- National Applied Research Laboratories Taiwan
- Instrument Technology Research Center
- Department of Materials Science and Engineering
- National Tsing Hua University
- Department of Materials Science and Engineering
- Precision Instrument Development Center
External person
S. G. Bishop
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
External person
Wen Chin Lee
- University of California at Berkeley
- IEEE
- Intel
- Taiwan Semiconductor Manufacturing Company
- Department of Electrical Engineering
- Advanced Micro Devices
- Strategie Technology Group
- Department of EECS
- Hitachi, Ltd.
- Exploratory Research Division
- Department of Electrical Engineering and Computer Science
- Dept. of Elec. Eng./Comp. Sciences
- Department of Electrical Engineering
External person
Chun Yen Peng
- Department of Electrical Engineering
- National Taiwan University
- Institute of Photonics and Optoelectronics
- Hon Hai Research Institute
- Hon Hai Research Institute
- Hon Hai Precision Industry
External person
R. S. Batzer
- Semiconduct. Prod. Grp./Qual. R.
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Intel
External person
Kuniyuki Kakushima
- Department of Electronics and Applied Physics
- Tokyo Institute of Technology
- Interdisciplinary Graduate School of Sci. and Eng.
- Interdisciplinary Graduate School of Science and Technology
- Department of Physical Electronics
- The University of Tokyo
- CSIR - Indian Institute of Chemical Technology
- Frontier Collaborative Research Center
- Université Grenoble Alpes
- The Electrochemical Society
- Kyoto University
- CSIR - National Physical Laboratory
- IMEP (UMR CNRS-INPG-UJF) ENSERG
External person
Yu Heng Hong
- Department of Photonics and Institute of Electro-Optical Engineering
- National Yang Ming Chiao Tung University
- Department of Photonics
- Natl Chiao Tung Univ, National Yang Ming Chiao Tung University, Coll Elect & Comp Engn, Grad Inst Electroopt Engn
- Hon Hai Research Institute
- Hon Hai Precision Industry
External person
J. I. Malin
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
External person
H. C. Liu
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Inst. for Microstructural Sciences
- National Research Council of Canada
- Inst. of Microstructural Sciences
- Institute for Microstructural Sciences
External person
Yuh Jen Cheng
- Academia Sinica - Research Center for Applied Science
- Department of Electro-Optical Engineering
- National Yang Ming Chiao Tung University
- Department of Photonics
- Research Center for Applied Sciences
- Department of Photonic
- Department of Electrical Engineering
- Department of Photonics and Institute of Electro-Optical Engineering
- Department of Photonics
- Department of Photonics
- Department of Photonics
- Research Center for Applied Sciences
- Department of Photonics
- Department of Photonics
- Department of Photonics
- Department of Photonics
- Acad Sinica, Academia Sinica - Taiwan, Res Ctr Appl Sci
External person
Wei Chou Hsu
- Institute of Microelectronics
- National Cheng Kung University
- Institute of Microelectronics
- Institute of Microelectronics
- Advanced Optoelectronic Technology Center
- Department of Electrical Engineering
- Institute of Microelectronics
- Department of Electrical Engineering
External person
W. Fang
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
External person
Fan Ren
- Department of Chemical Engineering
- University of Florida
- Department of Chemical Engineering
- Lucent
- Department of Chemical Engineering
- Multiplex Inc.
External person
You Chen Weng
- National Yang Ming Chiao Tung University
- Institute of Lighting and Energy Photonics
External person
P. J. Sung
- Department of Electrophysics
- National Nano Device Laboratories Taiwan
- National Yang Ming Chiao Tung University
- National Applied Research Laboratories Taiwan
- Hsinchu
- Scientific
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Manufacture Co.
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- NARL
- Taiwan Semiconductor Research Institute (TSRI)
- Taiwan Semiconductor Research Institute
External person
Azrul Azlan Hamzah
- Universiti Kebangsaan Malaysia
- Institute of Micronengineering and Nanoelectronics (IMEN)
- Univ Kebangsaan Malaysia, Universiti Kebangsaan Malaysia, Inst Microengn & Nanoelect
External person
Deepak Anandan
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
External person
P. Ahmet
- Frontier Research Center
- Tokyo Institute of Technology
- Department of Electronics and Applied Physics
- Frontier Collaborative Research Center
- The Electrochemical Society
External person
Q. J. Hartmann
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
External person
An Chen Liu
- National Yang Ming Chiao Tung University
- Natl Chiao Tung Univ, National Yang Ming Chiao Tung University, Coll Elect & Comp Engn, Grad Inst Electroopt Engn
External person
Shih Hong Chen
- Taiwan Semiconductor Manufacture Co.
- National Applied Research Laboratories Taiwan
- NARL
External person
J. Y. Cheng
- Rutgers - The State University of New Jersey, New Brunswick
- Rutgers University
External person
A. Daga
- Department of Materials Science and Engineering
- University of Illinois at Urbana-Champaign
- Department of Materials Science
External person
M. Taysing-Lara
- Electronics and Power Sources Directorate
- United States Army Research Laboratory
- Rutgers - The State University of New Jersey, New Brunswick
- Rutgers University
External person
J. Mazumder
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Ctr. for Laser-Aided Mat. Processing
- Center for Laser-Aided Material Processing
External person
C. J. Su
- National Nano Device Laboratories Taiwan
- Department of Electrical Engineering
- National Yang Ming Chiao Tung University
- Institute of Electronics
- Department of Electronics Engineering and Institute of Electronics
- Nano Facility Center
- Institute of Electronics
- Hsinchu
- Department O Electronics Engineering
- Department of Electrical Engineering
- IEEE
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- National Applied Research Laboratories Taiwan
- Taiwan Semicond Res Inst
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Research Institute
- Taiwan Semiconductor Manufacture Co.
- Taiwan Semiconductor Research Institute
- University of Houston
- Taiwan Semiconductor Research Institute (TSRI)
External person
H. Hsia
- Univ. Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- CCEEL
- Department of Materials Science and Engineering
External person
J. M. Gibson
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
External person
W. E. Mayo
- Dept. of Mechanics and Mat. Science
- Rutgers - The State University of New Jersey, New Brunswick
- Lucent
- Department of Chemical Engineering
- University of Florida
- Rutgers University
External person
Venkatesan Nagarajan
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Hexawave, Inc.
External person
Y. C. Wang
- Rutgers - The State University of New Jersey, New Brunswick
- Electrical and Computer Engineering Department
- Lucent
- Department of Ceramic and Materials Engineering
- Rutgers University
External person
Y. C. Wang
- Lucent
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Lucent Technologies
External person
K. C. Hsieh
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- CCEEL
- Dept. of Mat. Sci. and Engineering
- Nano Device Laboratory
- National Yang Ming Chiao Tung University
External person
I. Adesida
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
External person
V. P. Dravid
- Department of Materials Science and Engineering
- Northwestern University
- Department of Materials Science and Engineering
External person
D. K. Sengupta
- California Institute of Technology
- University of Illinois at Urbana-Champaign
- Elec. and Comp. Eng. Department
- Ctr. Space Microlectron. Technol.
- Jet Propulsion Laboratory, California Institute of Technology
- Ctr. Space Microelectronics Technol.
- Dept. of Mat. Sci. and Engineering
External person
M. Wraback
- Electronics and Power Sources Directorate
- United States Army Research Laboratory
- Rutgers - The State University of New Jersey, New Brunswick
- Rutgers University
External person
Ting Wei Chuang
- Institute of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Department of Materials Science and Engineering
External person
D. Scott
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Univ. Illinois at Urbana-Champaign
External person
Young Kai Chen
- Communication Science Research Department
- Lucent
- Communication Science Research Department at Bell Laboratories
- Nokia
- Defense Advanced Research Projects Agency
- Communication Science Research Department
- Communication Science Research Department at Bell Laboratories
- Department of Chemical Engineering
- University of Florida
External person
Z. Tang
- CCEEL
- University of Illinois at Urbana-Champaign
- Department of Materials Science and Engineering
External person
Sang Woo Lee
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Dept. Mat. Sci. Eng. Frederick S.
- Department of Materials Science and Engineering
- Department of Materials Science
External person
Min Lu Kao
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
External person
C. H. Chen
- Taiwan Semiconductor Manufacturing Company
- Research and Development
- Institute of Microelectronics
- National Cheng Kung University
- Logic Technology Division
External person
Yuan Lin
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
External person
Chen Yu Chen
- Institute of Materials Science and Engineering
- National Yang Ming Chiao Tung University
External person
Yu Sheng Chiu
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Compound Semiconductor Device Laboratory
External person
Joseph S. Weiner
- Department of Chemical Engineering
- Multiplex Inc.
- University of Florida
- Lucent
External person
Yung Yu Lai
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Academia Sinica - Research Center for Applied Science
External person
Hong Quan Nguyen
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
- Department of Materials Science and Engineering
- Department of Electrical Engineering
External person
S. L. Chuang
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
External person
Xia Xi Zheng
- Department of Materials Science and Engineering
- National Yang Ming Chiao Tung University
External person
James R. Lothian
- Department of Ceramic and Materials Engineering
- Lucent
- Rutgers - The State University of New Jersey, New Brunswick
- Elec. and Comp. Eng. Department
- University of Illinois at Urbana-Champaign
- Filtronic Solid State
- Rutgers University
External person
W. C. Lee
- Department of Electrophysics
- National Yang Ming Chiao Tung University
- Industrial Technology Research Institute Hsinchu
External person