智 陳

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Chih Chen

Professor

 https://orcid.org/0000-0001-6235-2827
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
1997 …2024

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  • 2012

    Electromigration in Pb-Free Solder Joints in Electronic Packaging

    Chen, C., Liang, S. W., Chang, Y. W., Hsiao, H. Y., Han, J. K. & Tu, K.-N., 15 Mar 2012, Lead-free Solders: Materials Reliability for Electronics. Wiley-Blackwell, p. 375-399 25 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

    1 Scopus citations

  • Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

    Tian, T., Tu, K.-N., Chen, H. Y., Hsiao, H. Y. & Chen, C., 15 Mar 2012, Lead-free Solders: Materials Reliability for Electronics. Wiley-Blackwell, p. 424-442 19 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

  • 2007

    Electromigration issues in lead-free solder joints

    Chen, C. & Liang, S. W., 1 Dec 2007, Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics. Springer US, p. 259-268 10 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

    15 Scopus citations

  • Stress analysis of spontaneous Sn whisker growth

    Tu, K.-N., Chen, C. & Wu, A. T., 2007, Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics. Springer US, p. 269-281 13 p.

    Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

    18 Scopus citations