Chih Chen

Projects

Projects per year 2008 2017 2018 2020 2021 2022 2025

• 1 Active
• 52 Finished

Projects per year

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• Active

  低溫銅銅接合暨完全消除接合界面之微凸塊接點

  Chen, C. (PI)

  1/08/24 → 31/07/25

  Project: Government Ministry › Other Government Ministry Institute

• Finished

  奈米雙晶銅導線電遷移研究

  Chen, C. (PI)

  1/08/23 → 31/07/24

  Project: Government Ministry › Other Government Ministry Institute

• 低溫銅銅接合暨完全消除接合界面之微凸塊接點

  Chen, C. (PI)

  1/08/23 → 31/07/24

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心111年9月至10月技術服務(公家機構)

  Chen, C. (PI)

  1/09/22 → 31/10/22

  Project: Government Ministry › Other Government Ministry Institute

• 奈米雙晶銅導線電遷移研究

  Chen, C. (PI)

  1/08/22 → 31/07/23

  Project: Government Ministry › Other Government Ministry Institute

• 低溫銅銅接合暨完全消除接合界面之微凸塊接點

  Chen, C. (PI)

  1/08/22 → 31/07/23

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心111年7月至8月技術服務(公家機構)

  Chen, C. (PI)

  1/07/22 → 31/08/22

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心111年5月至6月技術服務(公家機構)

  Chen, C. (PI)

  1/05/22 → 30/06/22

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心111年3月至4月技術服務(公家機構)

  Chen, C. (PI)

  1/03/22 → 30/04/22

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心110年11月至12月技術服務(公家機構)

  Chen, C. (PI)

  1/11/21 → 31/12/21

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心110年9月至10月技術服務(公家機構)

  Chen, C. (PI)

  1/09/21 → 31/10/21

  Project: Government Ministry › Other Government Ministry Institute

• 奈米雙晶銅導線電遷移研究

  Chen, C. (PI)

  1/08/21 → 31/07/22

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心110年7月至8月技術服務(公家機構)

  Chen, C. (PI)

  1/07/21 → 31/08/21

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心110年5月至6月技術服務(公家機構)

  Chen, C. (PI)

  1/05/21 → 30/06/21

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心109年11月至12月技術服務(公家機構)

  Chen, C. (PI)

  1/11/20 → 31/12/20

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心109年9月至10月技術服務(公家機構)

  Chen, C. (PI)

  1/09/20 → 31/10/20

  Project: Government Ministry › Other Government Ministry Institute

• 材料科學與工程學系109年9月至10月技術服務(國立交通大學)

  Chen, C. (PI)

  1/09/20 → 31/10/21

  Project: Government Ministry › Other Government Ministry Institute

• Measurement of Mechanical Properties for Cu Nanopillars Using InsituInsitu

  Chen, C. (PI)

  1/08/20 → 31/07/21

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心109年7月至8月技術服務(公家機構)

  Chen, C. (PI)

  1/07/20 → 31/08/20

  Project: Government Ministry › Other Government Ministry Institute

• High Energy Density Li-Ion-Battery Using Electroplated Nanotwinned Cu Foils as Negative electrodes and Li-Rich Oxides as Positive Electrodes

  Chen, C. (PI)

  1/04/20 → 31/03/21

  Project: Government Ministry › Other Government Ministry Institute

• Development of Additives for Nanotwinned Cu and Its Aplications in Pacakaging of High-End Devices.

  Chen, C. (PI)

  1/08/19 → 31/07/20

  Project: Government Ministry › Other Government Ministry Institute

• Measurement of Mechanical Properties for Cu Nanopillars Using InsituInsitu

  Chen, C. (PI)

  1/08/19 → 31/07/20

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心107年10月至12月技術服務(公家機構)

  Chen, C. (PI)

  1/10/18 → 31/12/18

  Project: Government Ministry › Other Government Ministry Institute

• Development of Additives for Nanotwinned Cu and Its Aplications in Pacakaging of High-End Devices.

  Chen, C. (PI)

  1/08/18 → 31/01/20

  Project: Government Ministry › Other Government Ministry Institute

• Measurement of Mechanical Properties for Cu Nanopillars Using InsituInsitu

  Chen, C. (PI)

  1/08/18 → 31/07/19

  Project: Government Ministry › Other Government Ministry Institute

• Cu-to-Cu Direct Bonding Using Electroplated Nanotwinned Cu

  Chen, C. (PI)

  1/08/18 → 31/07/19

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心107年7月至9月技術服務(公家機構)

  Chen, C. (PI)

  1/07/18 → 30/09/18

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心107年4月至6月技術服務(公家機構)

  Chen, C. (PI)

  1/04/18 → 30/06/18

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心107年1月至3月技術服務(公家機構)

  Chen, C. (PI)

  1/01/18 → 31/03/18

  Project: Government Ministry › Other Government Ministry Institute

• 前瞻材料研究中心106年10月至12月技術服務(公家機構)

  Chen, C. (PI)

  1/10/17 → 31/12/17

  Project: Government Ministry › Other Government Ministry Institute

• Development of Additives for Nanotwinned Cu and Its Aplications in Pacakaging of High-end Devices

  Chen, C. (PI)

  1/08/17 → 31/07/19

  Project: Government Ministry › Other Government Ministry Institute

• Study of Grain Growth in Nanotwinned Cu Films

  Chen, C. (PI)

  1/08/17 → 31/07/18

  Project: Government Ministry › Other Government Ministry Institute

• Cu-to-Cu Direct Bonding Using Electroplated Nanotwinned Cu

  Chen, C. (PI)

  1/08/17 → 31/07/18

  Project: Government Ministry › Other Government Ministry Institute

• Study of Grain Growth in Nanotwinned Cu Films

  Chen, C. (PI)

  1/08/16 → 31/07/17

  Project: Government Ministry › Other Government Ministry Institute

• Cu-to-Cu Direct Bonding Using Electroplated Nanotwinned Cu

  Chen, C. (PI)

  1/08/16 → 31/07/17

  Project: Government Ministry › Other Government Ministry Institute

• Study of Grain Growth in Nanotwinned Cu Films

  Chen, C. (PI)

  1/08/15 → 31/07/16

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration and Metallurgical Reactions in Solder Joints with <111>-Oriented Nanotwinned Cu Metallization

  Chen, C. (PI)

  1/08/15 → 31/07/16

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration and Metallurgical Reactions in Solder Joints with <111>-Oriented Nanotwinned Cu Metallization

  Chen, C. (PI)

  1/08/14 → 31/07/15

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration of Microbumps in 3D IC Packaging

  Chen, C. (PI)

  1/08/14 → 31/07/15

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration and Metallurgical Reactions in Solder Joints with <111>-Oriented Nanotwinned Cu Metallization

  Chen, C. (PI)

  1/08/13 → 31/07/14

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration of Microbumps in 3D IC Packaging

  Chen, C. (PI)

  1/08/13 → 31/07/14

  Project: Government Ministry › Other Government Ministry Institute

• Electromigration of Microbumps in 3D IC Packaging

  Chen, C. (PI)

  1/08/12 → 31/07/13

  Project: Government Ministry › Other Government Ministry Institute

• In-Situ TEM Study on Sn Whisker Growth and Rotation of Sn Grains During Current Stressing

  Chen, C. (PI)

  1/08/12 → 31/07/13

  Project: Government Ministry › Other Government Ministry Institute

• 以同步輻射繞射法觀測銲錫受電遷移之影響(2/2)

  Chen, C. (PI)

  1/03/12 → 20/09/13

  Project: Government Ministry › Other Government Ministry Institute

• Effect of Al-trace Design on The Electromigration of Flip-chip Solder Joints(1/3)

  Chen, C. (PI)

  1/08/11 → 31/07/12

  Project: Government Ministry › Other Government Ministry Institute

• In-Situ TEM Study on Sn Whisker Growth and Rotation of Sn Grains During Current Stressing

  Chen, C. (PI)

  1/08/11 → 31/07/12

  Project: Government Ministry › Other Government Ministry Institute

• 以同步輻射繞射法觀測銲錫受電遷移之影響

  Chen, C. (PI)

  1/09/10 → 28/02/12

  Project: Government Ministry › Other Government Ministry Institute

• In-Situ TEM Study on Sn Whisker Growth and Rotation of Sn Grains During Current Stressing

  Chen, C. (PI)

  1/08/10 → 31/07/11

  Project: Government Ministry › Other Government Ministry Institute

• Effect of Al-trace Design on The Electromigration of Flip-chip Solder Joints(1/3)

  Chen, C. (PI)

  1/08/10 → 31/07/11

  Project: Government Ministry › Other Government Ministry Institute

• 以電流驅動錫晶鬚的成長之研究(3/3)

  Chen, C. (PI)

  1/08/09 → 31/10/10

  Project: Government Ministry › Other Government Ministry Institute