Projects per year
Personal profile
Research Interests
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low temperature Cu-to-Cu direct bonding
Education/Academic qualification
PhD, Materials Science and Engineering, University of California, Los Angeles
External positions
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 53 Finished
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
Chen, C. (PI)
1/08/24 → 31/07/25
Project: Government Ministry › Other Government Ministry Institute
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奈米雙晶銅導線電遷移研究
Chen, C. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
Chen, C. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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前瞻材料研究中心111年9月至10月技術服務(公家機構)
Chen, C. (PI)
1/09/22 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
Chen, C. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Breaking strength-conductivity trade-off in nanotwinned Cu by Fe Co-electroplating and its thermal stability characterization
Tran, D. P., Chen, B. Y., La, M. P., Lee, K. P. & Chen, C., May 2025, In: Materials Characterization. 223, 114925.Research output: Contribution to journal › Article › peer-review
6 Scopus citations -
Design of surface topography for fabricating nanotwinned copper/polyimide hybrid joints using in-situ heating atomic force microscopy
He, P. S., Tran, D. P., Shie, K. C. & Chen, C., 15 Mar 2025, In: Applied Surface Science. 685, 162023.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Dimensional Effects on Grain Size and Surface Orientation of Nanocrystalline Cu in SiO2 Micro-Vias
Chao, T. H., Lin, H. E., Tran, D. P. & Chen, C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 93-94 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Direction-dependent mechanical strength of nanostructure-tuned copper
Lee, K. P., Chen, H. C., Tran, D. P., Chen, B. Y. & Chen, C., Oct 2025, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 942, 148666.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Effect of Cu microstructures on Cu/SiO2 hybrid bonding for 3D IC heterogeneous integration
Chen, C., Lin, H. E., Chiu, W. L. & Chang, H. H., 2025, 9th IEEE Electron Devices Technology and Manufacturing Conference: Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025. Institute of Electrical and Electronics Engineers Inc., (9th IEEE Electron Devices Technology and Manufacturing Conference: Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
Prizes
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Award for Excellent Contributions in Technology Transfer, Ministry of Science Technology
Chen, C. (Recipient), 2017
Prize: Honorary award
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Y. Z. Hsu Technology Invention Award, Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Chen, C. (Recipient), 2018
Prize: Honorary award
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Scientific Reports (Event)
Chen, C. (Member of editorial board)
1 Jan 2018 → 31 Dec 2018Activity: Publication peer-review and editorial work › Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chen, C. (Speaker)
4 Oct 2015Activity: Talk or presentation › Invited talk