Projects per year
Personal profile
Research Interests
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low temperature Cu-to-Cu direct bonding
Education/Academic qualification
PhD, Materials Science and Engineering, University of California, Los Angeles
External positions
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/24 → 31/07/25
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates
Chang, S. Y., Huang, Y. C., Lin, S. Y., Lu, C. L., Chen, C. & Dao, M., Jan 2023, In: Nanomaterials. 13, 1, 190.Research output: Contribution to journal › Article › peer-review
Open Access -
Artificial intelligence deep learning for 3D IC reliability prediction
Hsu, P. N., Shie, K. C., Chen, K. P., Tu, J. C., Wu, C. C., Tsou, N. T., Lo, Y. C., Chen, N. Y., Hsieh, Y. F., Wu, M., Chen, C. & Tu, K-N., Dec 2022, In: Scientific reports. 12, 1, 6711.Research output: Contribution to journal › Article › peer-review
Open Access -
Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions
Sharma, M., Chen, C. C. A., Chen, C. & He, P. S., Jun 2022, In: ECS Journal of Solid State Science and Technology. 11, 6, 064004.Research output: Contribution to journal › Article › peer-review
Open Access -
Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis
Hsu, W. Y., Tseng, I. H., Chiang, C. Y., Tu, K. N. & Chen, C., Sep 2022, In: Journal of Materials Research and Technology. 20, p. 2799-2808 10 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils
Fang, C. Y., Tran, D. P., Liu, H. C., Ong, J. J., Lin, Y. Q., Hsu, W. Y. & Chen, C., 1 Apr 2022, In: Journal of the Electrochemical Society. 169, 4, 042503.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations
Prizes
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Award for Excellent Contributions in Technology Transfer, Ministry of Science Technology
Chen, Chih (Recipient), 2017
Prize: Honorary award
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Y. Z. Hsu Technology Invention Award, Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Chen, Chih (Recipient), 2018
Prize: Honorary award
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Scientific Reports (Event)
Chih Chen (Member of editorial board)
1 Jan 2018 → 31 Dec 2018Activity: Publication peer-review and editorial work › Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chih Chen (Speaker)
4 Oct 2015Activity: Talk or presentation › Invited talk