Projects per year
Personal profile
Research Interests
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low temperature Cu-to-Cu direct bonding
Education/Academic qualification
PhD, Materials Science and Engineering, University of California, Los Angeles
External positions
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/24 → 31/07/25
Project: Government Ministry › Other Government Ministry Institute
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前瞻材料研究中心111年9月至10月技術服務(公家機構)
1/09/22 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics
Shen, G. Y. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 183-184 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2Hybrid Bonding
Yang, S. C., Ong, J. J., Tran, D. P., Chiu, W. L., Lee, O. H., Chiang, C. W., Chang, H. H., Wang, C. H. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 13-14 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity
Ong, J. J., Chiu, W. L., Chang, H. H., Tran, D. P. & Chen, C., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 15-16 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation
He, P. S., Tran, D. P., Kuo, T. Y., Hsu, W. Y., Lin, H. E., Shie, K. C. & Chen, C., May 2023, In: Nanomaterials. 13, 9, 1575.Research output: Contribution to journal › Article › peer-review
Open Access -
Highly Selective Electrochemical Reduction of CO2 into Methane on Nanotwinned Cu
Cai, J., Zhao, Q., Hsu, W. Y., Choi, C., Liu, Y., Martirez, J. M. P., Chen, C., Huang, J., Carter, E. A. & Huang, Y., 26 Apr 2023, In: Journal of the American Chemical Society. 145, 16, p. 9136-9143 8 p.Research output: Contribution to journal › Article › peer-review
Open Access4 Scopus citations
Prizes
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Award for Excellent Contributions in Technology Transfer, Ministry of Science Technology
Chen, Chih (Recipient), 2017
Prize: Honorary award
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Y. Z. Hsu Technology Invention Award, Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Chen, Chih (Recipient), 2018
Prize: Honorary award
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Scientific Reports (Event)
Chih Chen (Member of editorial board)
1 Jan 2018 → 31 Dec 2018Activity: Publication peer-review and editorial work › Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chih Chen (Speaker)
4 Oct 2015Activity: Talk or presentation › Invited talk