Projects per year
Personal profile
Research Interests
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low temperature Cu-to-Cu direct bonding
Education/Academic qualification
PhD, Materials Science and Engineering, University of California, Los Angeles
External positions
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
Chen, C. (PI)
1/08/24 → 31/07/25
Project: Government Ministry › Other Government Ministry Institute
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奈米雙晶銅導線電遷移研究
Chen, C. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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低溫銅銅接合暨完全消除接合界面之微凸塊接點
Chen, C. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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前瞻材料研究中心111年9月至10月技術服務(公家機構)
Chen, C. (PI)
1/09/22 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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奈米雙晶銅導線電遷移研究
Chen, C. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Characterization of Surface Activation on Nanotwinned Copper and SiCN by using Ar and N2 Plasma
Lee, R. J., He, P. S., Chiu, W. L., Chang, H. H., Hsu, W. Y. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 77-78 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly <111>-Oriented Nanotwinned Cu
He, P. S. & Chen, C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 1998-2002 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints
Huang, J. Y. & Chen, C., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 626-630 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints
Tran, D. P., Liu, Y. T. & Chen, C., May 2024, In: Materials. 17, 9, 2004.Research output: Contribution to journal › Article › peer-review
Open Access -
Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films
Lin, H. E., Tran, D. P., Lin, G. H., Chuang, H. J. & Chen, C., May 2024, In: Materials Characterization. 211, 113891.Research output: Contribution to journal › Article › peer-review
Prizes
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Award for Excellent Contributions in Technology Transfer, Ministry of Science Technology
Chen, C. (Recipient), 2017
Prize: Honorary award
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Y. Z. Hsu Technology Invention Award, Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Chen, C. (Recipient), 2018
Prize: Honorary award
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Scientific Reports (Event)
Chen, C. (Member of editorial board)
1 Jan 2018 → 31 Dec 2018Activity: Publication peer-review and editorial work › Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chen, C. (Speaker)
4 Oct 2015Activity: Talk or presentation › Invited talk