Projects per year
Personal profile
Research Interests
Electromigration and metallurgical reactions in flip-chip solder joints
3D IC packaging
Nanotwinned Cu: fabrication and application
Low temperature Cu-to-Cu direct bonding
Education/Academic qualification
PhD, University of California, Los Angeles
External positions
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Projects
- 37 Finished
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前瞻材料研究中心109年9月至10月技術服務(公家機構)
1/09/20 → 31/10/20
Project: Government Ministry › Other Government Ministry Institute
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Measurement of Mechanical Properties for Cu Nanopillars Using InsituInsitu
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
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前瞻材料研究中心109年7月至8月技術服務(公家機構)
1/07/20 → 31/08/20
Project: Government Ministry › Other Government Ministry Institute
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High Energy Density Li-Ion-Battery Using Electroplated Nanotwinned Cu Foils as Negative electrodes and Li-Rich Oxides as Positive Electrodes
1/04/20 → 31/03/21
Project: Government Ministry › Ministry of Science and Technology
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Measurement of Mechanical Properties for Cu Nanopillars Using InsituInsitu
1/08/19 → 31/07/20
Project: Government Ministry › Ministry of Science and Technology
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Effect of anisotropic grain growth on improving the bonding strength of -oriented nanotwinned copper films
Chang, S. Y., Chu, Y. C., Tu, K-N. & Chen, C., 15 Feb 2021, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 804, 9 p., 140754.Research output: Contribution to journal › Article › peer-review
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Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating
Cheng, H-Y., Dinh-Phuc Tran, Tu, K-N. & Chen, C., 15 Apr 2021, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 811, 8 p., 141065.Research output: Contribution to journal › Article › peer-review
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Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films
Tseng, I. H., Hsu, Y. T., Leu, J-P., Tu, K-N. & Chen, C., Mar 2021, In: Acta Materialia. 206, 116637.Research output: Contribution to journal › Article › peer-review
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Electromigration failure mechanisms of 〈1 1 1〉 -oriented nanotwinned Cu redistribution lines with polyimide capping
Tseng, I. H., Hsu, P. N., Lu, T. L., Tu, K-N. & Chen, C., May 2021, In: Results in Physics. 24, 104154.Research output: Contribution to journal › Article › peer-review
Open Access -
Anisotropic grain growth in (111) nanotwinned cu films by DC electrodeposition
Lu, T. L., Shen, Y. A., Wu, J. A. & Chen, C., 1 Jan 2020, In: Materials. 13, 1, 134.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations
Prizes
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Award for Excellent Contributions in Technology Transfer, Ministry of Science Technology
Chen, Chih (Recipient), 2017
Prize: Honorary award
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Y. Z. Hsu Technology Invention Award, Far Eastern Y. Z. Hsu Science and Technology Memorial Foundation
Chen, Chih (Recipient), 2018
Prize: Honorary award
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Scientific Reports (Event)
Chih Chen (Member of editorial board)
1 Jan 2018 → 31 Dec 2018Activity: Publication peer-review and editorial work › Editorial work
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The 66th Annual Meeting of the International Society of Electrochemistry
Chih Chen (Speaker)
4 Oct 2015Activity: Talk or presentation › Invited talk