Research output per year
Research output per year
- 14 results
Search results
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2024
Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force
Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding
Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 75-76 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
Chen, Y. S., Chiu, T. W., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2184-2188 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2023
Aggressively Scaled Atomic Layer Deposited Amorphous InZnOxThin Film Transistor Exhibiting Prominent Short Channel Characteristics (SS= 69 mV/dec.; DIBL = 27.8 mV/V) and High Gm(802 μS/μm at VDS= 2V)
Liang, Y. K., Zheng, J. Y., Lin, Y. L., Li, W. L., Lu, Y. C., Hsieh, D. R., Peng, L. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Tseng, Y.-C., Chao, T.-S., Chang, E. Y. & Lin, C. H., 2023, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023. Institute of Electrical and Electronics Engineers Inc., (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2023-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
6 Scopus citations -
Boron Ion Implantation-Induced Embedded Layers for Ultra-Thin Die Structures
Chen, Y. S., Chiu, T. W., Ko, Y. C., Fan, H. T., Huang, Y. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 717-720 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Demonstration of Mos2 Memtransistor with Poly-Si Source/Drain Featuring Tunable Conductance States and Boosted ION
Li, K. S., Huang, M. K., Wang, Y. H., Tseng, Y. C. & Su, C. J., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Electrical Determination of Magnetization Switching in In-plane Anisotropy Spin-orbit Systems
Huang, Y. H., Lin, Y. L., Wu, Y. H. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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First Demonstration of Highly Scaled Atomic Layer Deposited Ultrathin InSnZnO Channel Thin Film Transistor Exhibiting Superior Electrical Characteristics
Liang, Y. K., Zheng, J. Y., Lin, Y. L., Chen, Y., Chen, K. L., Hsieh, D. R., Peng, L. C., Chiu, C. H., Lu, Y. C., Chou, T. T., Kei, C. C., Lu, C. C., Huang, H. Y., Lin, Y. M., Tseng, Y. C., Chao, T. S., Chang, E. Y. & Lin, C. H., 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers Inc., (Technical Digest - International Electron Devices Meeting, IEDM).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Novel Strain Release Self-Assembly Design of Silver Nanowires and Application in Flexible Strain Sensors
Chen, Y. S., Ko, Y. C., Fan, H. T., Lin, C. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 761-765 5 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Reduced Switching Current with a Light Metal in a Tri-layer Spin-orbit Torque Device
Wu, Y. H., Cheng, C. W., Lin, Y. L., Chen, M. C. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Reusable Detector of ZnO-based Transistor in Floating Gate Structure for High Sensitivity pH Sensor
Chen, Y. S., You, H. C., Lin, C. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 664-667 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Scalable Spin-to-Charge Conversion Effect in the Inverse Spin Hall Nanodevice
Lin, Y. L., Hsin, T. C., Wu, Y. H., Sun, Y.-C. & Tseng, Y. C., 2023, 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Using a Mixed Solvent to Improve the Morphology of Thin Films, a One-Step Method is Employed to form Three-Dimensional Lead-Free Perovskite Solar Cells
Huang, Y. C., Chen, Y. S., Tseng, P. C., Lin, C. C., You, H. C. & Ko, F. H., 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers Inc., p. 227-230 4 p. (2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2022
The thermal stability improvement of spin-orbit-torque (SOT) devices with a thin PtMn insertion
Chang, Y. J., Chen, F. M., Chen, K. M., Yang, S. Y., Hsin, Y. C., Rahaman, S. Z., Wang, I. J., Lee, H. H., Su, Y. H., Chen, G. L., Shih, C. Y., Chiu, S. C., Wei, J. H., Sheu, S. S., Lo, W. C., Tseng, Y. C., Lai, C. H., Tang, D. & Wu, C. I., 2022, 2022 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2022. Institute of Electrical and Electronics Engineers Inc., (2022 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review