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Dive into the research topics where Undergraduate Honors Program of Nano Science and Engineering is active. These topic labels come from the works of this organization's members. Together they form a unique fingerprint.
Collaborations and top research areas from the last five years
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Research output
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Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force
Chen, Y. S., Liu, S. Y., Lin, C. C., Fan, H. T., Ko, Y. C., Chen, C. C. & Ko, F. H., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 255-256 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Aluminum-doped zinc oxide thickness controllable wavelengths in visible light and high responsivity devices using interrupted flow atomic layer deposition
Tseng, P. H., Lai, Y. S., Huang, C. M., Tsai, S. Y. & Ko, F. H., May 2024, In: Journal of Materials Science: Materials in Electronics. 35, 13, 922.Research output: Contribution to journal › Article › peer-review
Open Access3 Scopus citations -
Benefits of Combining Gate-Field Plates Design and Hybrid Drains on Gold-Free GaN HEMT Devices
Chen, Y. S., Lai, Y., Lin, Z. Y., Huang, Y. C., Yu, C. T., Ko, F. H., Chen, C. C., Al-Hagri, A. & You, H. C., 2024, 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024. Institute of Electrical and Electronics Engineers Inc., p. 136-139 4 p. (2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review