National Yang Ming Chiao Tung University

2024

Surface Modification by Wet Treatment for Low-Temperature Cu/SiO₂ Hybrid Bonding

Chen, Y. A., Ong, J. J., Chiu, W. L., Chang, H. H. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 115-116 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Talking Head Generation Based on 3D Morphable Facial Model

Shen, H. Y. & Tsai, W. J., 2024, 2024 Picture Coding Symposium, PCS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 Picture Coding Symposium, PCS 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Temperature-Insensitive Soft-Error-Tolerant Flip-Flop Design For Automotive Electronics

Yee, R. E. H., Su, N. Y. J., Wang, L. P. T., Wen, C. H. P. & Chiueh, H.-M., 2024, Proceedings - 2024 IEEE 42nd VLSI Test Symposium, VTS 2024. IEEE Computer Society, (Proceedings of the IEEE VLSI Test Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TensorGRAF: Tensorial Generative Radiance Field

Yu, P. C., Way, D. L. & Shih, Z. C., 2024, International Workshop on Advanced Imaging Technology, IWAIT 2024. Nakajima, M., Lau, P. Y., Kim, J.-G., Kubo, H., Chang, C.-Y. & Kemao, Q. (eds.). SPIE, 1316403. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 13164).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Test Structures of Cross-Domain Interface Circuits with Deep N-Well Layout to Improve CDM ESD Robustness

Huang, H. M. & Ker, M. D., 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Microelectronic Test Structures).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Test Structures to Investigate ESD Robustness of Integrated GaN Devices

Wang, W. C. & Ker, M. D., 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Microelectronic Test Structures).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

The Benefits of Near-field Manipulation and Viewing to Distant Object Manipulation in VR

Babu, S. V., Hsieh, W. A. & Chuang, J. H., 2024, Proceedings - 2024 IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2024. Institute of Electrical and Electronics Engineers Inc., p. 408-417 10 p. (Proceedings - 2024 IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

The Development of an Endoscope-Assisted iMET to Improve the Distal Screw Hole Positioning Efficacy in Interlocking Nailing Procedures

Shih, C. W., Chiang, T. L. & Chu, W. C., 2024, Frontier Computing on Industrial Applications Volume 3 - Proceedings of Theory, Technologies and Applications FC 2023. Hung, J. C., Yen, N. & Chang, J.-W. (eds.). Springer Science and Business Media Deutschland GmbH, p. 294-298 5 p. (Lecture Notes in Electrical Engineering; vol. 1133 LNEE).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

The Effect of Electromigration and Stress Migration on NT-Cu RDLs Passivated with Titanium Dioxide

Lin, Y. Q., Tang, C. Y., Hung, Y. W., Lin, Y. Y. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 155-156 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

The Enhancement in the Reliability of Nanotwinned Cu Redistribution Lines Passivated with Immersion Sn and Ag

Hung, Y. W., Lin, Y. Q. & Chen, C., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 103-104 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

The LoD Enhancement Study of MIP-Based Troponin T in Urine Sensing Electrodes Using Modified Methylene Blue/Anodic Aluminum Oxide (MIP/MB/AAO) Nanocomposite Structures

Chen, C., Tsai, C. Y., Cheng, Y. T., Tsai, H. E. & Lo, Y. C., 2024, IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc., p. 312-315 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TinyTS: Memory-Efficient TinyML Model Compiler Framework on Microcontrollers

Liu, Y. Y., Zheng, H. S., Fang Hu, Y., Hsu, C. F. & Yeh, T. T., 2024, Proceedings - 2024 IEEE International Symposium on High-Performance Computer Architecture, HPCA 2024. IEEE Computer Society, p. 848-860 13 p. (Proceedings - International Symposium on High-Performance Computer Architecture).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Trade-off Between Thermal Budget and Thickness Scaling: A Bottleneck on Quest for BEOL Compatible Ultra-Thin Ferroelectric Films Sub-5nm

Chiu, C. Y., De, S., Cho, C. Y. & Hou, T. H., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TrafficEd: Deployment and Management System of Edge AI Cameras

Chen, G. W., Lin, Y. H. & Ik, T. U., 2024, Proceedings of IEEE/IFIP Network Operations and Management Symposium 2024, NOMS 2024. Hong, J.W.-K., Seok, S.-J., Nomura, Y., Wang, Y.-C., Choi, B.-Y., Kim, M.-S., Riggio, R., Tsai, M.-H. & dos Santos, C. R. P. (eds.). Institute of Electrical and Electronics Engineers Inc., (Proceedings of IEEE/IFIP Network Operations and Management Symposium 2024, NOMS 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Transformer and Its Variants for Identifying Good Dice in Bad Neighborhoods

Lu, C. C., Chang, C. C., Yen, C. H., Chang, S. W., Chu, Y. H., Wu, K. C. & Chao, M. C. T., 2024, Proceedings - 2024 IEEE 42nd VLSI Test Symposium, VTS 2024. IEEE Computer Society, (Proceedings of the IEEE VLSI Test Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Transformer-Based Learned Image Compression for Joint Decoding and Denoising

Chen, Y. H., Ho, K. W., Tsai, S. R., Lin, G. H., Gnutti, A., Peng, W. H. & Leonardi, R., 2024, 2024 Picture Coding Symposium, PCS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 Picture Coding Symposium, PCS 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Triple Self-Aligned Split-Gate Architecture for High-Speed Applications of 4H-SiC VDMOSFETs

Hung, C. L., Tsui, B. Y., Hsiao, Y. K. & Kuo, H. C., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Efficient Hardware Root of Trust

Shih, C., Hong, M. C., Wang, C. Y., Chen, G. L., Lee, H. H., Chen, K. M., Chiou, B. C., Chang, Y. J., Yang, S. Y., Huang, S. Y., Lo, C. Y., Su, Y. H., Wang, I. J., Shih, C. Y., Chiu, S. C., Hsin, Y. C., Wei, J. H., Sheu, S. S., Lo, W. C. & Chang, S. C. & 1 others, Hou, T. H., 2024, 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Utilizing Non-Orthogonal Multiple Access (NOMA) for Flexible Data Rate Allocation in Integrated Mode Division Multiplexing (MDM) Optical Power Divider

Lin, Y. Z., Jian, Y. H., Chow, C. W. & Yeh, C. H., 2024, 2024 IEEE Silicon Photonics Conference, SiPhotonics 2024 - Proceedings. IEEE Computer Society, (IEEE International Conference on Group IV Photonics GFP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Validation of Dynamically Depleted Symmetric BSIM-SOI Compact model for RF SOI T/R Switch Applications

Nandi, D., Dabhi, C. K., Rajasekaran, D., Karumuri, N., Turuvekere, S., Swaminathan, B., Srihari, S., Dutta, A., Hu, C. & Chauhan, Y. S., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Virtual reality based Neural Sensors with Respirator for Cardiorespiratory Synchrony Training System

Lu, Y. E., Yeh, S. C., Wu, E. H. K., Liu, L. & Lin, S. K., 2024, Proceedings - 2024 IEEE 9th International Conference on Smart Cloud, SmartCloud 2024. Institute of Electrical and Electronics Engineers Inc., p. 86-91 6 p. (Proceedings - 2024 IEEE 9th International Conference on Smart Cloud, SmartCloud 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

VisCollage: Annotative Collages for Organizing Data Event Charts

Li, X. H., Hung, Y. T., Pan, J. Y. & Lin, W. C., 2024, Proceedings - 2024 IEEE 17th Pacific Visualization Conference, PacificVis 2024. IEEE Computer Society, p. 262-271 10 p. (IEEE Pacific Visualization Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Water-to-Air PAM4 Optical Camera Communication Using Long Short Term Memory Neural Network (LSTM-NN)

Chang, Y. H., Tsai, S. Y., Tsai, M. C., Li, J. F., Jian, Y. H., Chow, C. W. & Yeh, C. H., 2024, 2024 Optical Fiber Communications Conference and Exhibition, OFC 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 Optical Fiber Communications Conference and Exhibition, OFC 2024 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

WER: Maximizing Parallelism of Irregular Graph Applications Through GPU Warp EqualizeR

Huang, E. M., Cheng, B. W., Lin, M. H., Lee, C. Y. & Yeh, T. T., 2024, ASP-DAC 2024 - 29th Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 201-206 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

WKB model of ferroelectric tunnel junctions for memory applications: voltage-dependent screening and electrostriction effects

Jagga, D., De, S. & Useinov, A., 2024, IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024. Institute of Electrical and Electronics Engineers Inc., (IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

“AsyncELF”: Development of Event-Based 3D Imaging for Hypersonic FSI Measurements

Tan, Z. P., Hsu, K. & Tan, J. M., 2024, AIAA SciTech Forum and Exposition, 2024. American Institute of Aeronautics and Astronautics Inc, AIAA, (AIAA SciTech Forum and Exposition, 2024).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

“I Prefer Regular Visitors to Answer My Qestions”: Users' Desired Experiential Background of Contributors for Location-based Crowdsourcing Platform

Lin, F. Y., Tsai, P. H., Lee, C. Y., Ho, Y. T., Chen, Y. K., Yen, Y. C. & Chang, Y. J., 11 May 2024, CHI 2024 - Proceedings of the 2024 CHI Conference on Human Factors in Computing Sytems. Association for Computing Machinery, 735. (Conference on Human Factors in Computing Systems - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Open Access

2023

11.4 A Double Step-Down Dual-Output Converter with Cross Regulation of 0.025mV/mA and Improved Current Balance

Hung, W. C., Chen, C. W., Huang, Y. W., Chen, A., Yang, Z. Y., Chen, K. H., Zhenq, K. L., Lin, Y. H., Lin, S. R., Tsai, T. Y. & Huang, W. C., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 188-190 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

11.7 A Wide 0.1-to-10 Conversion-Ratio Symmetric Hybrid Buck-Boost Converter for USB PD Bidirectional Conversion

Lin, C., Hung, C. S., Li, S. Y., Hsu, Y. T., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 194-196 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

20.1 A High Common-Mode Transient Immunity GaN-on-SOI Gate Driver for High dV/dt SiC Power Switch

Li, S. Y., Hung, W. C., Wang, T. W., Hsu, Y. T., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 302-304 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

20.3 A GaN Gate Driver with On-chip Adaptive On-time Controller and Negative Current Slope Detector

Lin, S. Y., Lin, S. Y., Hung, S. H., Wang, T. W., Li, C. H., Go, C. L., Huang, S. C., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 306-308 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

20.4 Multiple-Phase Accelerated Current Control in Bidirectional Energy Transfer of Automotive High-Voltage and Low-Voltage Batteries

Wang, T. W., Li, S. Y., Hung, S. H., Wu, T. Y., Chen, C. Y., Chiu, P. J., Chen, K. H., Zheng, K. L., Lin, Y. H., Tsai, T. Y. & Lin, S. R., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 308-310 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2D-3D Interlaced Transformer for Point Cloud Segmentation with Scene-Level Supervision

Yang, C. K., Chen, M. H., Chuang, Y. Y. & Lin, Y. Y., 2023, Proceedings - 2023 IEEE/CVF International Conference on Computer Vision, ICCV 2023. Institute of Electrical and Electronics Engineers Inc., p. 977-987 11 p. (Proceedings of the IEEE International Conference on Computer Vision).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Open Access

2 Scopus citations

2nd Workshop on Multimodal Motion Sickness Detection and Mitigation Methods for Car Journeys - Finding Consensus in the Field

Pöhlmann, K. M. T., Al Taie, A. J. S., Li, G., Dam, A., Wang, Y. K., Wei, C. S. & Papaioannou, G., 18 Sep 2023, 15th International Conference on Automotive User Interfaces and Interactive Vehicular Applications, AutomotiveUI 2023 - Adjunct Conference Proceedings. Association for Computing Machinery, p. 223-226 4 p. (ACM International Conference Proceeding Series).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Open Access

30.2 A 93.2%-Efficiency Multi-Input Bipolar Energy Harvester with 17.9× MPPT Loss Reduction

Yang, Z. Y., Chen, A., Chen, C. W., Hung, W. C., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 440-442 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

30.8 3D Wireless Power Transfer with Noise Cancellation Technique for -62dB Noise Suppression and 90.1% Efficiency

Huang, F., Tsai, H. Y., Huang, C. Y., Luo, Y. C., Li, C. H., Huang, S. C., Kao, Y. H., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, 2023 IEEE International Solid-State Circuits Conference, ISSCC 2023. Institute of Electrical and Electronics Engineers Inc., p. 452-454 3 p. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2023-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

3D micropatterned multiphoton stimulation via deep computergenerated holography with digital propagation matrix

Lu, S. Y., Chi, H. C., Chen, L. W., Hsu, F. C., Lin, C. Y., Hu, Y. Y. & Chen, S. J., 2023, Advances in Microscopic Imaging IV. Beaurepaire, E., Ben-Yakar, A. & Park, Y. (eds.). SPIE, 126300A. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12630).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5nm FinFET Cryogenic SRAM Evaluation for Quantum Computing

Parihar, S. S., Thomann, S., Pahwa, G., Chauhan, Y. S. & Amrouch, H., 2023, 2023 Device Research Conference, DRC 2023. Institute of Electrical and Electronics Engineers Inc., (Device Research Conference - Conference Digest, DRC; vol. 2023-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

A 0.12-V 200-Hz-BW 10-Bit ADC Using Quad-Channel VCO and Interpolation Linearization

Smith, S., Barton, T., Kuan, Y. C., Tajalli, A., Chang, M. C. F. & Chiang, S. H. W., 2023, 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

A 1.32 to 1.89 GHz Diplexer/Filtering-Switch for Reconfigurable FDD/TDD Operations

Wei, Z., Ning, Y., Chi, P. L., Xu, R. & Yang, T., 2023, 2023 IEEE/MTT-S International Microwave Symposium, IMS 2023. Institute of Electrical and Electronics Engineers Inc., p. 839-842 4 p. (IEEE MTT-S International Microwave Symposium Digest; vol. 2023-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

A 13 × W, 94 mK Resolution, CMOS PD ΔΣ M Temperature-to-Digital Converter With Power-Gating Technique

Huang, Y. J., Huang, Y. C., Chiu, Y. H., Tsai, W. P. & Liao, Y. T., 2023, ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. IEEE Computer Society, p. 17-20 4 p. (European Solid-State Circuits Conference; vol. 2023-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 1700 V-Class Self-Aligned Channel and Split Gate (SASG) Architecture of 4H-SiC VDMOSFET for High Frequency Application

Hung, C. L., Hsiao, Y. K. & Kuo, H. C., 2023, WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia. Institute of Electrical and Electronics Engineers Inc., (WiPDA Asia 2023 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 2~3.6 GHz Reconfigurable Bandpass Filter Based on GaAs Technology

Zhu, B. Y., Yang, T. & Chi, P. L., 2023, 7th International Symposium on Electromagnetic Compatibility, ISEMC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 2-18 GHz 8-W Distributed GaN Power Amplifier Based on Input and Output Matching Network

Pu, Z., Zhu, X., Qi, L., Wang, Y., Chi, P. L. & Yang, T., 2023, 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

A 2-18GHz Digitally Controlled Variable Gain Amplifier with Low Phase Shift and Large Dynamic Range

Liu, J., Zhang, T., Chi, P. L. & Yang, T., 2023, 2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 26nA Ultra-Low Input Current, 81nW Ultra-Low Power and 1μs Recovery Time Ultra-Fast Transient DC-DC Buck Converter for Internet-of-Things

Lee, S. C., Liang, Y. T., Tsai, H. Y., Huang, J. R., Chen, P. C., Liu, C. H., Shih, Y. T., Chen, K. H., Zheng, K. L., Lin, Y. H., Lin, S. R. & Tsai, T. Y., 2023, ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. IEEE Computer Society, p. 317-320 4 p. (European Solid-State Circuits Conference; vol. 2023-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

A 2-step deep learning approach to splenic injury detection

Chen, Y. L., Chung, I. F., Cheng, C. T. & Lin, H. S., 2023, 2023 International Conference on Fuzzy Theory and Its Applications, iFUZZY 2023. Institute of Electrical and Electronics Engineers Inc., (2023 International Conference on Fuzzy Theory and Its Applications, iFUZZY 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

A 2W 9.5-16.5 GHz GaN Power Amplifier with 30% PAE Using Transformer-Based Output Matching Network

Sun, X., Zhu, X., Wang, Y., Chi, P. L. & Yang, T., 2023, 2023 IEEE/MTT-S International Microwave Symposium, IMS 2023. Institute of Electrical and Electronics Engineers Inc., p. 319-322 4 p. (IEEE MTT-S International Microwave Symposium Digest; vol. 2023-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 5MHz LC-LC Resonant Wireless Power Transfer System

Lu, C. Y., Chen, H. C. & Chan, C. W., 2023, ICPE 2023-ECCE Asia - 11th International Conference on Power Electronics - ECCE Asia: Green World with Power Electronics. Institute of Electrical and Electronics Engineers Inc., p. 2567-2572 6 p. (ICPE 2023-ECCE Asia - 11th International Conference on Power Electronics - ECCE Asia: Green World with Power Electronics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

A 6.78-MHz Wireless Power Transfer System with Voltage-/Current-Mode 0X/1X Regulating Rectifier and Global-Loop Power Control

Wu, B. J., Yao, D. H. & Chen, P. H., 2023, 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

National Yang Ming Chiao Tung University

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