Projects per year
Fingerprint
Dive into the research topics where Institute of Architecture is active. These topic labels come from the works of this organization's members. Together they form a unique fingerprint.
Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
異自然:感知-離散-連續體(2/2)
1/01/23 → 31/12/23
Project: Government Ministry › Other Government Ministry Institute
-
深度學習木材特性之機械臂彎曲木構實驗
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
-
111年至112年美感與設計課程創新計畫-總計畫學校工作計畫
1/01/22 → 31/12/23
Project: Government Ministry › Ministry of Education(Include School)
-
3D printing on freeform surface: Real-time and accurate 3D dynamic dense surface reconstruction with HoloLens and displacement measurement sensors
Sheng, Y. T., Liong, S. T., Wang, S. Y. & Gan, Y. S., Jan 2023, In: Advances in Mechanical Engineering. 15, 1Research output: Contribution to journal › Article › peer-review
Open Access -
3D SOC-Net: Deep 3D reconstruction network based on self-organizing clustering mapping
Gan, Y. S., Chen, W., Yau, W. C., Zou, Z., Liong, S. T. & Wang, S. Y., 1 Mar 2023, In: Expert Systems with Applications. 213, 119209.Research output: Contribution to journal › Article › peer-review
-
An improved automatic defect identification system on natural leather via generative adversarial network
Gan, Y. S., Liong, S. T., Wang, S. Y. & Cheng, C. T., 2022, (Accepted/In press) In: International Journal of Computer Integrated Manufacturing.Research output: Contribution to journal › Article › peer-review
3 Scopus citations
Prizes
-
Chevalier de L'ordre des Arts et des Lettres, Ministry of Culture
Tseng, Chun-Tei (Recipient), 2018
Prize: Honorary award
-
Solar Decathlon Europe, CSTB/United States Department of Energy
Tseng, Chun-Tei (Recipient), 2005
Prize: Honorary award
-